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Multilayer PCB Assembly for Pre-amp

Multilayer PCB Assembly for Pre-amp

MOQ : 6000Pieces
Payment Terms : Telegraphic Transfer (TT,T/T)
MOQ : 6000 Pieces
Main Export Markets : Eastern EuropeNorth AmericaMid East/AfricaCentral/South AmericaAsiaWestern EuropeAustralasia
Place of Origin : China (mainland)
Model Number : PCB Assemblies
Lead Time : 30-45days
Category : Multilayer PCB
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Key Specifications/Special Features:

  • Multilayer PCB assembly for pre-amp
  • Layer: 2 to 22
  • Product types: rigid PCB, high-density inverter PCB, thick copper PCB
  • Materials: FR-4, CEM-3, non-stick coating, aluminum substrate, halogen-free
  • Laser blind hole thickness to diameter ratio: 0.8:1 (maximum)

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Multilayer PCB Assembly for Pre-amp Images

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